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Combines multiple integrated circuit dies in a single package without stacking them into a three-dimensional integrated circuit with through-silicon vias

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  • چندین دای مدار مجتمع را در یک بسته تک بدون انباشتن آنها در یک مدار مجتمع سه‌بُعدی با میان‌راه‌های ازمیان‌سیلیکونی ترکیب می‌کند. (fa)
  • combines multiple integrated circuit dies in a single package without stacking them into a three-dimensional integrated circuit with through-silicon vias (en)
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  • 2.5D integrated circuit (en)
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