Browse using
OpenLink Faceted Browser
OpenLink Structured Data Editor
LodLive Browser
Formats
RDF:
N-Triples
N3
Turtle
JSON
XML
OData:
Atom
JSON
Microdata:
JSON
HTML
Embedded:
JSON
Turtle
Other:
CSV
JSON-LD
Faceted Browser
Sparql Endpoint
About:
Three-dimensional integrated circuit
An Entity of Type:
Thing
,
from Named Graph:
http://dbpedia.org
,
within Data Space:
dbpedia-live.demo.openlinksw.com
Integrated circuit with vertical interconnections
Property
Value
dbo:
description
Verbindungstechnik in der Halbleitertechnik
(de)
integrated circuit with vertical interconnections
(en)
chip com duas ou mais camadas de componentes eletrônicos ativos, com integração horizontal e vertical em um único circuito
(pt)
és un circuit integrat en tecnologia 3D.
(ca)
dbo:
thumbnail
wiki-commons
:Special:FilePath/3DS_die_stacking_concept_model.png?width=300
dbo:
wikiPageExternalLink
http://www.a-elpida.com/ja/technology/tsv.html
http://www.monolithic3d.com/ion-cut-the-building-block.html
https://archive.today/20130121221433/http:/www.eetimes.com/news/semi/showArticle.jhtml%3FarticleID=53700960
https://archive.today/20130122085527/http:/www.electroiq.com/index/display/article-display/366226/articles/advanced-packaging/packaging0/equipment/die-bonding-equipment/3d-integration-a-status-report.html/
http://www.samsung.com/us/business/semiconductor/newsView.do%3Fnews_id=1231
http://www.wiley-vch.de/publish/dt/books/newTitles201201/3-527-32646-4/%3FsID=p2qlnooj68su7htl8qrrc2qjt3
http://www.eetimes.com/news/semi/showArticle.jhtml%3FarticleID=53700960
http://www.eetimes.com/story/OEG20011219S0041
http://sst.pennnet.com/Articles/Article_Display.cfm%3FARTICLE_ID=254615
http://pc.watch.impress.co.jp/docs/column/kaigai/20111107_488696.html
http://www.edn.com/article/CA410764.html
http://www.eedesign.com/article/showArticle.jhtml%3FarticleId=17408808
http://www.electroiq.com/articles/sst/2013/08/monolithic-3d-is-now-in-production-samsung-starts-mass-producing-first-3d-vertical-nand-flash.html
http://www.electroiq.com/articles/sst/2013/08/monolithic-3d-is-now-on-the-roadmap-for-2019.html
http://www.electroiq.com/index/display/article-display/366226/articles/advanced-packaging/packaging0/equipment/die-bonding-equipment/3d-integration-a-status-report.html/
http://www.amkor.com/index.cfm%3Fobjectid=437C1C10-5056-AA0A-E2626E3C762307FF
http://www.amkor.com/index.cfm%3Fobjectid=8A586C38-F4D0-4CD8-7AD50C7BA98E3417
http://www.amkor.com/index.cfm%3Fobjectid=9A9D6655-E2FD-713C-AE2761D3B9EFB250
http://www.amkor.com/index.cfm%3Fobjectid=AC1A3242-F9FC-76B7-D0D77E166839BF9B
http://www.amkor.com/index.cfm%3Fobjectid=B173A68F-A106-490B-70B5650D6ACFB6DE
http://www.amkor.com/index.cfm%3Fobjectid=CAB8D948-F34D-8E73-72961B951D0877D7
http://realworldtech.com/page.cfm%3FArticleID=RWT050207213241
http://www.oki.com/jp/otr/2007/n211/pdf/211_r17.pdf
http://www.semiconductor.net/article/202251-How_Might_3_D_ICs_Come_Together_.php
http://www.semiconductor.net/article/CA604503.html
http://www.semiconductor.net/article/CA6431663.html
http://www.monolithic3d.com/uploads/6/0/5/5/6055488/ieee_3d_ic_conference_invited_monolithic_3d.pdf
https://web.archive.org/web/20071106080914/http:/www.semiconductor.net/article/CA6431663.html
https://web.archive.org/web/20080212184730/http:/www.semiconductor.net/article/CA604503.html
https://web.archive.org/web/20080515200141/http:/www.eetimes.com/story/OEG20011219S0041
https://web.archive.org/web/20081203230736/http:/www.edn.com/article/CA410764.html
https://web.archive.org/web/20100304084239/http:/www.semiconductor.net/article/202251-How_Might_3_D_ICs_Come_Together_.php
https://web.archive.org/web/20130818084414/http:/www.electroiq.com/articles/sst/2013/08/monolithic-3d-is-now-in-production-samsung-starts-mass-producing-first-3d-vertical-nand-flash.html
https://web.archive.org/web/20130819075724/http:/www.electroiq.com/articles/sst/2013/08/monolithic-3d-is-now-on-the-roadmap-for-2019.html
http://www.prweb.com/releases/3D_chips/3D_IC/prweb4400904.htm
dbo:
wikiPageWikiLink
dbr
:Computer_memory
dbr
:Pentium_4
dbr
:Research_and_development
dbr
:Bell_Labs
dbr
:NEC
dbr
:Wafer_bonding
dbr
:GlobalFoundries
dbr
:Integrated_circuit_packaging
dbr
:Through-silicon_via
dbr
:Central_processing_unit
dbr
:Flash_memory
dbr
:Microprocessor
dbr
:Transistor
dbr
:Bandwidth_(signal_processing)
dbc
:MOSFETs
dbr
:Toshiba
dbr
:International_Technology_Roadmap_for_Semiconductors
dbr
:Die_(integrated_circuit)
dbr
:JEDEC
dbr
:Electronic_component
dbr
:Parallel_processing_(DSP_implementation)
dbr
:Gate_array
dbr
:Flip_chip
dbr
:Tohoku_University
dbr
:System_monitor
dbr
:Electrical_connection
dbr
:Reverse_engineering
dbr
:Static_random-access_memory
dbr
:Wafer_(electronics)
dbr
:Osaka_University
dbc
:Japanese_inventions
dbr
:Intel
dbr
:Arithmetic_logic_unit
dbr
:Embedded_system
dbr
:Texas_Instruments
dbr
:University_of_Michigan
dbr
:Nanoelectronics
dbr
:Silicon_on_insulator
dbr
:Netlist
dbr
:Charge_trap_flash
dbr
:MOSFET
dbr
:Hybrid_Memory_Cube
dbr
:Phosphosilicate_glass
dbr
:Process_variation_(semiconductor)
dbr
:Gibibyte
dbr
:Terabyte
dbr
:Bus_(computing)
dbr
:Microelectronics
dbr
:Semiconductor_device_fabrication
dbr
:Mobile_device
dbc
:Integrated_circuits
dbc
:Semiconductor_device_fabrication
dbr
:Sony
dbr
:Stanford_University
dbr
:Integrated_circuit
dbr
:Siemens
dbr
:AMD
dbc
:Packaging_(microfabrication)
dbr
:Micron_Technology
dbr
:Silicon_nitride
dbr
:Dynamic_random-access_memory
dbr
:Fujitsu
dbr
:DARPA
dbr
:Wafer-level_packaging
dbr
:Wafer_dicing
dbr
:40_nanometer
dbr
:Firewall_(computing)
dbr
:Moore's_law
dbr
:Security_through_obscurity
dbr
:University_of_Rochester
dbr
:Fraunhofer_Society
dbr
:Semiconductor_memory
dbr
:1980s_in_Japan
dbr
:Interposer
dbr
:TSMC
dbr
:Teraflops_Research_Chip
dbr
:Wire_bonding
dbr
:CMOS
dbr
:PlayStation_Portable
dbr
:Computer-aided_design
dbr
:Parasitic_capacitance
dbr
:Samsung_Electronics
dbr
:EDRAM
dbr
:Hitachi
dbr
:Mitsubishi_Electric
dbr
:Panasonic
dbr
:SK_Hynix
dbr
:Handheld_game_console
dbr
:Semiconductor_intellectual_property_core
dbr
:Place_and_route
dbr
:Multigate_device
dbr
:OEM
dbr
:DDR3
dbr
:Redistribution_layer
dbr
:DDR4
dbr
:Mobile_devices
dbr
:Multi-chip_package
dbr
:Package_on_package
dbr
:Optical_sensor
dbr
:High_Bandwidth_Memory
dbr
:MIT
dbr
:MOS_integrated_circuit
dbr
:System-on-a-chip
dbr
:Elpida_Memory
dbr
:System_in_package
dbr
:FinFET
dbr
:SDRAM
dbr
:NMOS_FET
dbr
:Large-scale_integration
dbr
:Electronic_system
dbr
:Georgia_Institute_of_Technology
dbr
:NAND_flash
dbr
:Thin-film
dbr
:Silicon-on-insulator
dbr
:32_nanometer
dbr
:PSP_hardware
dbr
:File:Psp-1000.jpg
dbr
:Advanced_Semiconductor_Engineering
dbr
:A-to-D_converter
dbr
:Power_consumption
dbr
:Shift_registers
dbr
:Silicon_wafer
dbr
:Wafer_level_package
dbr
:Design_for_test
dbc
:Emerging_technologies
dbr
:Hynix
dbr
:Engineering_Change_Order
dbr
:HBM2
dbr
:Image_signal_processor
dbr
:Complementary_metal-oxide-semiconductor
dbr
:Memory_chip
dbr
:Memory_wall
dbr
:CMOS_logic
dbr
:System-in-package
dbr
:Mohamed_Atalla
dbr
:Semiconductor_fabrication
dbr
:Photosensors
dbr
:V-NAND
dbr
:File:3DS_die_stacking_concept_model.PNG
dbr
:File:High_Bandwidth_Memory_schematic.svg
dbp:
bot
InternetArchiveBot
(en)
dbp:
date
2012-04-25
(xsd:date)
February 2020
(en)
dbp:
fixAttempted
yes
(en)
dbp:
infocom
yes
(en)
dbp:
topics
yes
(en)
dbp:
url
https://web.archive.org/web/20120425154900/http:/www.a-elpida.com/ja/technology/tsv.html
dbp:
wikiPageUsesTemplate
dbt
:Digital_electronics
dbt
:Cite_book
dbt
:Cite_web
dbt
:Reflist
dbt
:Clear
dbt
:Cite_journal
dbt
:Dead_link
dbt
:Emerging_technologies
dbt
:Nbsp
dbt
:ISBN
dbt
:Refend
dbt
:As_of
dbt
:Refbegin
dbt
:Electronic_components
dbt
:Snd
dbt
:Webarchive
dbt
:Short_description
dct:
subject
dbc
:MOSFETs
dbc
:Japanese_inventions
dbc
:Integrated_circuits
dbc
:Semiconductor_device_fabrication
dbc
:Packaging_(microfabrication)
gold:
hypernym
dbr
:Circuit
rdfs:
label
Three-dimensional integrated circuit
(en)
دارة متكاملة ثلاثية الأبعاد
(ar)
3D-Integration
(de)
Chip tridimensional (3D)
(es)
Circuito integrado tridimensional
(pt)
三維晶片
(zh)
owl:
sameAs
freebase
:Three-dimensional integrated circuit
yago-res
:Three-dimensional integrated circuit
wikidata
:Three-dimensional integrated circuit
dbpedia-de
:Three-dimensional integrated circuit
dbpedia-zh
:Three-dimensional integrated circuit
dbpedia-pt
:Three-dimensional integrated circuit
dbpedia-es
:Three-dimensional integrated circuit
dbpedia-et
:Three-dimensional integrated circuit
dbpedia-ar
:Three-dimensional integrated circuit
dbpedia-global
:Three-dimensional integrated circuit
dbr
:Three-dimensional integrated circuit
prov:
wasDerivedFrom
wikipedia-en
:Three-dimensional_integrated_circuit?oldid=1293972910&ns=0
foaf:
depiction
wiki-commons
:Special:FilePath/Psp-1000.jpg
wiki-commons
:Special:FilePath/3DS_die_stacking_concept_model.png
wiki-commons
:Special:FilePath/High_Bandwidth_Memory_schematic.svg
foaf:
isPrimaryTopicOf
wikipedia-en
:Three-dimensional_integrated_circuit
is
dbo:
academicDiscipline
of
dbr
:Nader_Bagherzadeh
is
dbo:
product
of
dbr
:Tabula,_Inc.
is
dbo:
wikiPageRedirects
of
dbr
:3D-IC
dbr
:3DIC
dbr
:3DS_(die_stacking)
dbr
:3D_Computer_Chip
dbr
:3D_Die-Stacking
dbr
:3D_die-stacking
dbr
:3D_die_stacking
dbr
:3D_integrated_circuit
dbr
:3d_chip
dbr
:3D_IC
dbr
:3D_IC
dbr
:Chip_bonding
dbr
:Three_Dimensional_Integrated_Circuit
dbr
:Monolithic_3D_integrated_circuit
dbr
:Foveros
dbr
:Silicon_die_stacking
is
dbo:
wikiPageWikiLink
of
dbr
:PlayStation_Portable_hardware
dbr
:Xperi
dbr
:Integrated_circuit_packaging
dbr
:Transistor_count
dbr
:Through-silicon_via
dbr
:Flash_memory
dbr
:Random-access_memory
dbr
:Active-pixel_sensor
dbr
:Electronic_component
dbr
:Emerging_technologies
dbr
:Supercomputer
dbr
:System_on_a_chip
dbr
:List_of_Korean_inventions_and_discoveries
dbr
:Silicon_on_insulator
dbr
:DDR4_SDRAM
dbr
:Semiconductor_device_fabrication
dbr
:MCDRAM
dbr
:Integrated_circuit
dbr
:Package_on_a_package
dbr
:Field-programmable_gate_array
dbr
:Synchronous_dynamic_random-access_memory
dbr
:UCIe
dbr
:List_of_integrated_circuit_packaging_types
dbr
:3D-IC
dbr
:3DIC
dbr
:3DS_(die_stacking)
dbr
:3D_Computer_Chip
dbr
:3D_Die-Stacking
dbr
:3D_die-stacking
dbr
:3D_die_stacking
dbr
:3D_integrated_circuit
dbr
:3d_chip
dbr
:Moore's_law
dbr
:Interposer
dbr
:The_Age_of_Spiritual_Machines
dbr
:Teraflops_Research_Chip
dbr
:Single-photon_avalanche_diode
dbr
:Memory_module
dbr
:System_in_a_package
dbr
:Universal_Flash_Storage
dbr
:Multigate_device
dbr
:List_of_emerging_technologies
dbr
:2.5D_integrated_circuit
dbr
:Tabula_(company)
dbr
:Quilt_packaging
dbr
:Outline_of_information_technology
dbr
:High_Bandwidth_Memory
dbr
:Glossary_of_microelectronics_manufacturing_terms
dbr
:3D_IC
dbr
:Chip_bonding
dbr
:IEEE_Rebooting_Computing
dbr
:Superconducting_computing
dbr
:Advanced_packaging_(semiconductors)
dbr
:Three_Dimensional_Integrated_Circuit
dbr
:Monolithic_3D_integrated_circuit
dbr
:Foveros
dbr
:Silicon_die_stacking
dbr
:MOSFET_applications
is
dbp:
field
of
dbr
:Nader_Bagherzadeh
is
foaf:
primaryTopic
of
wikipedia-en
:Three-dimensional_integrated_circuit
This content was extracted from
Wikipedia
and is licensed under the
Creative Commons Attribution-ShareAlike 4.0 International