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Final stage of semiconductor device fabrication

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dbo:description
  • concetto (it)
  • concept (fr)
  • آخرین مرحله برساخت افزاره نیم‌رسانا (fa)
  • технологический этап упаковки кристалла интегральной схемы в корпус (ru)
  • IC製造過程的最後階段 (zh)
  • final stage of semiconductor device fabrication (en)
  • المرحلة النهائية من تصنيع مكونات أشباه الموصلات (ar)
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  • horizontal (en)
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  • Left is X-ray of right PCB, showing metal lead frames inside IC packages (en)
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  • Vectra-xa-scsicard hg.jpg (en)
  • Vectra-xa-scsicard-xray hg.jpg (en)
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rdfs:label
  • Integrated circuit packaging (en)
  • Encapsulat dels circuits integrats (ca)
  • Aufbau- und Verbindungstechnik (de)
  • Encapsulation (électronique) (fr)
  • パッケージ (電子部品) (ja)
  • Корпусирование интегральных схем (ru)
  • Корпусування мікросхем (uk)
  • 集成电路封装 (zh)
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